Transcend's HSD460I half-slim SSD is built with 112 layers of 3D NAND flash and the SATA III 6Gb/s interface, delivering never-before-seen transfer speeds. Applied with the Corner Bond technology and anti-sulfur resistor, the HSD460I is fortified to withstand demanding industrial applications. Following JEDEC's MO-297 standard, the HSD460I is fully tested in-house and is able to operate in wide operating temperatures ranging from -40℃∼85℃, ideal for read-heavy applications and space-limited mobile devices such as industrial control systems, medical equipment, mobile devices, and POS terminals.

Compliant with JEDEC MO-297
Anti-sulfur technology implemented to prevent sulfurization in the
environment
Key components fortified by default with Corner Bond technology
Promised operational reliability in a wide temperature range (from -40°C
to 85°C)

Dynamic thermal throttling
Built-in LDPC ECC (Error Correction Code) functionality
Advanced Global Wear-Leveling and Block management for reliability
Supports S.M.A.R.T. function to conduct health monitoring, analysis, and
reporting for storage devices