The Transcend PCIe M.2 SSDs features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves storage efficiency. The MTE670T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30μ" gold finger PCB and Corner Bond technology, it is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃ to 75℃.

SLC caching technology
Built-in LDPC ECC (Error Correction Code) functionality
Supports S.M.A.R.T. function to conduct health monitoring, analysis, and
reporting for storage devices
Advanced garbage collection
Advanced global wear-leveling and block management for reliability