Transcend MTE452T-I M.2 Internal SSD
- RS Stock No.:
- 240-5545
- Mfr. Part No.:
- TS512GMTE452T-I
- Brand:
- Transcend
Subtotal (1 unit)*
£697.34
(exc. VAT)
£836.81
(inc. VAT)
FREE delivery for orders over £60.00
Temporarily out of stock
- Shipping from 25 May 2026
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Units | Per unit |
|---|---|
| 1 + | £697.34 |
*price indicative
- RS Stock No.:
- 240-5545
- Mfr. Part No.:
- TS512GMTE452T-I
- Brand:
- Transcend
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Transcend | |
| Model Number | MTE452T-I | |
| Sub Type | 2242-D2-B-M (Double-Sided) | |
| Product Type | SSD | |
| Internal/External | Internal | |
| Industrial Grade | Yes | |
| Form Factor | M.2 | |
| NAND Type | TLC | |
| Interface Type | PCIe Gen 3.0 x4 NVMe | |
| Maximum Operating Temperature | 85°C | |
| Minimum Operating Temperature | -40°C | |
| Length | 42mm | |
| Height | 3.58mm | |
| Standards/Approvals | BSMI, FCC, CE | |
| Width | 22mm | |
| Select all | ||
|---|---|---|
Brand Transcend | ||
Model Number MTE452T-I | ||
Sub Type 2242-D2-B-M (Double-Sided) | ||
Product Type SSD | ||
Internal/External Internal | ||
Industrial Grade Yes | ||
Form Factor M.2 | ||
NAND Type TLC | ||
Interface Type PCIe Gen 3.0 x4 NVMe | ||
Maximum Operating Temperature 85°C | ||
Minimum Operating Temperature -40°C | ||
Length 42mm | ||
Height 3.58mm | ||
Standards/Approvals BSMI, FCC, CE | ||
Width 22mm | ||
- COO (Country of Origin):
- TW
The Transcend 512 GB SSD features the PCI Express (PCIe) Gen 3 x2 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. It has wide temperature (-40℃ ∼ 85℃) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications. It supports NVM command and has built-in LDPC ECC (Error Correction Code) functionality.
Endurance 3K P/E cycles (Program/Erase cycles) guaranteed
Key components fortified by default with Corner Bond technology
DDR3 DRAM Cache embedded
SLC caching technology
Dynamic thermal throttling
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