Xilinx FPGA XC3S50-5TQG144C, Spartan-3 1728 Cells, 50000 Gates, 12288bit, 1728 Blocks, 144-Pin TQFP
- RS Stock No.:
- 697-2829
- Mfr. Part No.:
- XC3S50-5TQG144C
- Brand:
- Xilinx
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 697-2829
- Mfr. Part No.:
- XC3S50-5TQG144C
- Brand:
- Xilinx
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Xilinx | |
Family Name | Spartan-3 | |
Number of Logic Gates | 50000 | |
Number of Logic Cells | 1728 | |
Number of Logic Units | 1728 | |
Number of Multipliers | 4 (18 x 18) | |
Mounting Type | Surface Mount | |
Package Type | TQFP | |
Pin Count | 144 | |
Number of RAM Bits | 12288bit | |
Dimensions | 20 x 20 x 1.4mm | |
Height | 1.4mm | |
Length | 20mm | |
Maximum Operating Temperature | +85 °C | |
Maximum Operating Supply Voltage | 1.26 V | |
Width | 20mm | |
Minimum Operating Temperature | 0 °C | |
Minimum Operating Supply Voltage | 1.14 V | |
Select all | ||
---|---|---|
Brand Xilinx | ||
Family Name Spartan-3 | ||
Number of Logic Gates 50000 | ||
Number of Logic Cells 1728 | ||
Number of Logic Units 1728 | ||
Number of Multipliers 4 (18 x 18) | ||
Mounting Type Surface Mount | ||
Package Type TQFP | ||
Pin Count 144 | ||
Number of RAM Bits 12288bit | ||
Dimensions 20 x 20 x 1.4mm | ||
Height 1.4mm | ||
Length 20mm | ||
Maximum Operating Temperature +85 °C | ||
Maximum Operating Supply Voltage 1.26 V | ||
Width 20mm | ||
Minimum Operating Temperature 0 °C | ||
Minimum Operating Supply Voltage 1.14 V | ||
Field Programmable Gate Arrays, Xilinx
An FPGA is a semiconductor device consisting of a matrix of Configurable Logic Blocks (CLBs) connected through programmable interconnects. The user determines these interconnections by programming SRAM. A CLB can be simple (AND, OR gates, etc) or complex (a block of RAM). The FPGA allows changes to be made to a design even after the device is soldered into a PCB.