TE Connectivity 2.54mm Pitch Vertical 8 Way, Through Hole Standard Pin Ladder IC Dip Socket, 1A
- RS Stock No.:
- 185-9851P
- Mfr. Part No.:
- 1-2199298-2
- Brand:
- TE Connectivity
Currently unavailable
Sorry, we don't know when this will be back in stock.
- RS Stock No.:
- 185-9851P
- Mfr. Part No.:
- 1-2199298-2
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Number of Contacts | 8 | |
| Mounting Type | Through Hole | |
| Pin Type | Standard | |
| Pitch | 2.54mm | |
| Row Width | 7.62mm | |
| Frame Type | Ladder | |
| Termination Method | Solder | |
| Contact Plating | Tin | |
| Current Rating | 1A | |
| Orientation | Vertical | |
| Length | 7.62mm | |
| Width | 10mm | |
| Depth | 5.1mm | |
| Dimensions | 7.62 x 10 x 5.1mm | |
| Contact Material | Phosphor Bronze | |
| Housing Material | PBT | |
| Maximum Operating Temperature | +105°C | |
| Voltage Rating | 250 V ac/dc | |
| Minimum Operating Temperature | -40°C | |
Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Number of Contacts 8 | ||
Mounting Type Through Hole | ||
Pin Type Standard | ||
Pitch 2.54mm | ||
Row Width 7.62mm | ||
Frame Type Ladder | ||
Termination Method Solder | ||
Contact Plating Tin | ||
Current Rating 1A | ||
Orientation Vertical | ||
Length 7.62mm | ||
Width 10mm | ||
Depth 5.1mm | ||
Dimensions 7.62 x 10 x 5.1mm | ||
Contact Material Phosphor Bronze | ||
Housing Material PBT | ||
Maximum Operating Temperature +105°C | ||
Voltage Rating 250 V ac/dc | ||
Minimum Operating Temperature -40°C | ||
Our large selection of DIP sockets ranging from 6 to 48 contacts provides a highly reliable connection between your integrated circuit (IC) devices and PCBs. Termination options include through hole and surface mounting, four-finger and dual leaf contacts, as well as a variety of plating options.
6 to 48 positions
Precision four-finger inner contacts or dual
Leaf contacts are optional
Open frame and closed frame housings
End-to-end and side-to-side stackable
Available with a variety of plating options
Quick IC mating/unmating
Easy field IC replacement
Avoidance of IC overheating during soldering
Flexibility of system upgrade
Large portfolio offers product closest to your need
Applications
Industrial controls
Intelligent buildings
Medical devices
Military
Other embedded systems
Precision four-finger inner contacts or dual
Leaf contacts are optional
Open frame and closed frame housings
End-to-end and side-to-side stackable
Available with a variety of plating options
Quick IC mating/unmating
Easy field IC replacement
Avoidance of IC overheating during soldering
Flexibility of system upgrade
Large portfolio offers product closest to your need
Applications
Industrial controls
Intelligent buildings
Medical devices
Military
Other embedded systems