Aries Electronics 2.54mm Pitch Vertical 40 Way, Through Hole Closed Frame IC Dip Socket, 3A

Technical Reference
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): US
Product Details

Low Profile DIL Eject Sockets

These sockets have a low profile, with a unique ejector/latching action
They are ideal for use where frequent removal of an IC is anticipated or where vibration may make other types unsuitable. The removal action ensures that the IC pins are undamaged
High reliability is ensured by the collet type contacts, which will accept either round or rectangular pins
The contacts are gold plated over beryllium copper and have tin-plated brass solder tails
Temperature Range: -55°C to +105°C (Tin); -55°C to +125°C (Gold)
Insulation Resistance: 10000MΩ (at 500Vdc)

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Specifications
Attribute Value
Number of Contacts 40
Mounting Type Through Hole
Pitch 2.54mm
Row Width 15.24mm
Frame Type Closed Frame
Termination Method Solder
Contact Plating Gold over Nickel
Current Rating 3A
Orientation Vertical
Length 58.2mm
Width 11.68mm
Depth 17.78mm
Dimensions 58.2 x 11.68 x 17.78mm
Maximum Operating Temperature +125°C
Contact Material Brass Alloy
Minimum Operating Temperature -55°C
Housing Material Nylon
Discontinued product