AAT20, Single-Sided Photoresist Board Aluminium With 35μm Copper Thick, 200 x 300 x 1.5mm
- RS Stock No.:
- 175-2780
- Mfr. Part No.:
- AAT20
- Brand:
- CIF
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 175-2780
- Mfr. Part No.:
- AAT20
- Brand:
- CIF
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | CIF | |
| Board Type | Photoresist Board | |
| Base Material | Aluminium | |
| Number of Sides | 1 | |
| Dimensions | 200 x 300 x 1.5mm | |
| Copper Thickness | 35µm | |
| FR Material Grade | Aluminium | |
| Length | 300mm | |
| Thickness | 200mm | |
| Width | 1.5mm | |
Select all | ||
|---|---|---|
Brand CIF | ||
Board Type Photoresist Board | ||
Base Material Aluminium | ||
Number of Sides 1 | ||
Dimensions 200 x 300 x 1.5mm | ||
Copper Thickness 35µm | ||
FR Material Grade Aluminium | ||
Length 300mm | ||
Thickness 200mm | ||
Width 1.5mm | ||
RoHS Status: Exempt
- COO (Country of Origin):
- FR
Layered photosensitive boards, copper on aluminium
Pre-sensitised printed circuit boards for making power supply cards, SMT power transistor-based circuits, hybrid power circuits etc.
These boards are also used as Insulated Metal Substrate (IMS) in optoelectronics for the design of power LED circuits such as OSRAM's Golden Dragon and Luxeon Star.
Significant dissipation enables denser component layout.
Insulation fulfils three functions:
- adhesive between the copper and the aluminium
- dielectric insulation between the copper and the aluminium
- thermal relay between the active face of the circuit and the aluminium heat dissipating sole
These boards are also used as Insulated Metal Substrate (IMS) in optoelectronics for the design of power LED circuits such as OSRAM's Golden Dragon and Luxeon Star.
Significant dissipation enables denser component layout.
Insulation fulfils three functions:
- adhesive between the copper and the aluminium
- dielectric insulation between the copper and the aluminium
- thermal relay between the active face of the circuit and the aluminium heat dissipating sole