50Ω STMicroelectronics Surface Mount Chip Balun
- RS Stock No.:
- 163-7353
- Mfr. Part No.:
- BALF-ATM-01E3
- Brand:
- STMicroelectronics
Stock information currently inaccessible
- RS Stock No.:
- 163-7353
- Mfr. Part No.:
- BALF-ATM-01E3
- Brand:
- STMicroelectronics
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Unbalance Impedance | 50Ω | |
| Balance Impedance | 50Ω | |
| Maximum Insertion Loss | 1.3dB | |
| Mounting Type | Surface Mount | |
| Pin Count | 6 | |
| Dimensions | 2.1 x 1.35 x 0.455mm | |
| Height | 0.455mm | |
| Length | 2.1mm | |
| Width | 1.35mm | |
| Maximum Frequency | 2.5GHz | |
| Minimum Frequency | 2400MHz | |
| Maximum Operating Temperature | +105°C | |
| Minimum Operating Temperature | -40°C | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Unbalance Impedance 50Ω | ||
Balance Impedance 50Ω | ||
Maximum Insertion Loss 1.3dB | ||
Mounting Type Surface Mount | ||
Pin Count 6 | ||
Dimensions 2.1 x 1.35 x 0.455mm | ||
Height 0.455mm | ||
Length 2.1mm | ||
Width 1.35mm | ||
Maximum Frequency 2.5GHz | ||
Minimum Frequency 2400MHz | ||
Maximum Operating Temperature +105°C | ||
Minimum Operating Temperature -40°C | ||
Baluns use ST’s process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function. ST's latest balun-the 1.2 mm² footprint BALF-NRG-02D3-is customized for our BlueNRG-1 and new BlueNRG-2 transceivers, reducing RF complexity and providing optimized link budget
The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance
2.4 – 2.5 GHz balun with integrated matching network
Matching optimized for following chipsets: ATSAMR21E18
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Coated CSP on glass bumpless
Small footprint 2.5 mm²
Matching optimized for following chipsets: ATSAMR21E18
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Coated CSP on glass bumpless
Small footprint 2.5 mm²