TDK, NLCV-EF, 1210 (3225M) Shielded Wire-wound SMD Inductor with a Ferrite Core, 1 μH ±20% Wire-Wound 1A Idc Q:10
- RS Stock No.:
- 181-4812
- Mfr. Part No.:
- NLCV32T-1R0M-EF
- Brand:
- TDK
Stock information currently inaccessible
- RS Stock No.:
- 181-4812
- Mfr. Part No.:
- NLCV32T-1R0M-EF
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Inductance | 1 μH | |
| Maximum DC Current | 1A | |
| Package/Case | 1210 (3225M) | |
| Length | 3.2mm | |
| Depth | 2.5mm | |
| Height | 2.2mm | |
| Dimensions | 3.2 x 2.5 x 2.2mm | |
| Shielded | Yes | |
| Tolerance | ±20% | |
| Maximum DC Resistance | 78mΩ | |
| Series | NLCV-EF | |
| Core Material | Ferrite | |
| Maximum Self Resonant Frequency | 100MHz | |
| Moulded | Yes | |
| Minimum Quality Factor | 10 | |
| Maximum Operating Temperature | +105°C | |
| Inductor Construction | Wire-Wound | |
| Minimum Operating Temperature | -40°C | |
| Select all | ||
|---|---|---|
Brand TDK | ||
Inductance 1 μH | ||
Maximum DC Current 1A | ||
Package/Case 1210 (3225M) | ||
Length 3.2mm | ||
Depth 2.5mm | ||
Height 2.2mm | ||
Dimensions 3.2 x 2.5 x 2.2mm | ||
Shielded Yes | ||
Tolerance ±20% | ||
Maximum DC Resistance 78mΩ | ||
Series NLCV-EF | ||
Core Material Ferrite | ||
Maximum Self Resonant Frequency 100MHz | ||
Moulded Yes | ||
Minimum Quality Factor 10 | ||
Maximum Operating Temperature +105°C | ||
Inductor Construction Wire-Wound | ||
Minimum Operating Temperature -40°C | ||
- COO (Country of Origin):
- JP
Resin mold type wound inductor for decoupling circuits.
Operating temperature range: –40 to +105°C (including self-temperature rise)
APPLICATION
Smart meters, AV equipment, xDSL, electronic devices for communications infrastructure such as mobile base stations, industrial equipment, other
Operating temperature range: –40 to +105°C (including self-temperature rise)
APPLICATION
Smart meters, AV equipment, xDSL, electronic devices for communications infrastructure such as mobile base stations, industrial equipment, other