TDK 10nF Multilayer Ceramic Capacitor MLCC, 630V dc V, ±10% , SMD
- RS Stock No.:
- 179-5146
- Mfr. Part No.:
- C3216X7R2J103K115AE
- Brand:
- TDK
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 179-5146
- Mfr. Part No.:
- C3216X7R2J103K115AE
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Capacitance | 10nF | |
| Voltage | 630V dc | |
| Package/Case | 1206 (3216M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X7R | |
| Tolerance | ±10% | |
| Dimensions | 3.2 x 1.6 x 1.15mm | |
| Length | 3.2mm | |
| Depth | 1.6mm | |
| Height | 1.15mm | |
| Series | C | |
| Maximum Operating Temperature | +125°C | |
| Suppression Class | Class 2 | |
| Minimum Operating Temperature | -55°C | |
Select all | ||
|---|---|---|
Brand TDK | ||
Capacitance 10nF | ||
Voltage 630V dc | ||
Package/Case 1206 (3216M) | ||
Mounting Type Surface Mount | ||
Dielectric X7R | ||
Tolerance ±10% | ||
Dimensions 3.2 x 1.6 x 1.15mm | ||
Length 3.2mm | ||
Depth 1.6mm | ||
Height 1.15mm | ||
Series C | ||
Maximum Operating Temperature +125°C | ||
Suppression Class Class 2 | ||
Minimum Operating Temperature -55°C | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor_Soft termination_General grade_C series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall.
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall.