Murata, LQG18HN, 0603 Multilayer Surface Mount Inductor with a Non-Magnetic Ceramic Core, 22 nH ±5% Multilayer 300mA
- RS Stock No.:
- 169-2768
- Mfr. Part No.:
- LQG18HN22NJ00D
- Brand:
- Murata
Discontinued
- RS Stock No.:
- 169-2768
- Mfr. Part No.:
- LQG18HN22NJ00D
- Brand:
- Murata
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Murata | |
| Inductance | 22 nH | |
| Maximum DC Current | 300mA | |
| Package/Case | 0603 | |
| Length | 1.6mm | |
| Depth | 0.8mm | |
| Height | 0.8mm | |
| Dimensions | 1.6 x 0.8 x 0.8mm | |
| Tolerance | ±5% | |
| Maximum DC Resistance | 500mΩ | |
| Series | LQG18HN | |
| Core Material | Non-Magnetic Ceramic | |
| Maximum Self Resonant Frequency | 2300MHz | |
| Minimum Quality Factor | 12 | |
| Inductor Construction | Multilayer | |
| Minimum Operating Temperature | -40°C | |
| Moulded | Yes | |
| Maximum Operating Temperature | +85°C | |
| Select all | ||
|---|---|---|
Brand Murata | ||
Inductance 22 nH | ||
Maximum DC Current 300mA | ||
Package/Case 0603 | ||
Length 1.6mm | ||
Depth 0.8mm | ||
Height 0.8mm | ||
Dimensions 1.6 x 0.8 x 0.8mm | ||
Tolerance ±5% | ||
Maximum DC Resistance 500mΩ | ||
Series LQG18HN | ||
Core Material Non-Magnetic Ceramic | ||
Maximum Self Resonant Frequency 2300MHz | ||
Minimum Quality Factor 12 | ||
Inductor Construction Multilayer | ||
Minimum Operating Temperature -40°C | ||
Moulded Yes | ||
Maximum Operating Temperature +85°C | ||
- COO (Country of Origin):
- JP
Murata 0603 LQG18HN Series High Frequency Chip Inductors
SMD inductors with monolithic structure, suitable for high frequency circuits.
High quality and stability at high frequency.
External electrodes with nickel barrier, offering great resistance to high soldering temperatures.
Applications: mobile telephony, Bluetooth communications, W-LAN networks, etc.
High quality and stability at high frequency.
External electrodes with nickel barrier, offering great resistance to high soldering temperatures.
Applications: mobile telephony, Bluetooth communications, W-LAN networks, etc.