Bergquist TSP 1800 Series Self-Adhesive Thermal Interface Pad, 0.012in Thick, 1.8W/m·K, Silicone, 12 x 12 x 0.012in
- RS Stock No.:
- 282-6865
- Mfr. Part No.:
- SIL PAD TSP 1800, 12in x 12in x 0.012 aca
- Brand:
- Bergquist
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- RS Stock No.:
- 282-6865
- Mfr. Part No.:
- SIL PAD TSP 1800, 12in x 12in x 0.012 aca
- Brand:
- Bergquist
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Bergquist | |
| Dimensions | 12 x 12 x 0.012in | |
| Thickness | 0.012in | |
| Length | 12in | |
| Width | 12in | |
| Thermal Conductivity | 1.8W/m·K | |
| Material | Silicone | |
| Self-Adhesive | Yes | |
| Series | TSP 1800 | |
Select all | ||
|---|---|---|
Brand Bergquist | ||
Dimensions 12 x 12 x 0.012in | ||
Thickness 0.012in | ||
Length 12in | ||
Width 12in | ||
Thermal Conductivity 1.8W/m·K | ||
Material Silicone | ||
Self-Adhesive Yes | ||
Series TSP 1800 | ||
RoHS Status: Exempt
- COO (Country of Origin):
- US
The Bergquist silicone based fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use as well as an optional adhesive coating. It exhibits exceptional thermal performance at low and high application pressures. The material is ideal for placement between electronic power devices and a heat sink for screw and clip mounted applications.
Exceptional thermal performance at lower application pressures
Smooth and non-tacky on both sides for easy re-positioning, ease of use and assembly error reduction
Superior breakdown voltage and surface wet out values
Designed for applications where
Smooth and non-tacky on both sides for easy re-positioning, ease of use and assembly error reduction
Superior breakdown voltage and surface wet out values
Designed for applications where