Bergquist HC5000 Series Self-Adhesive Thermal Gap Pad, 0.125in Thick, 5W/m·K, Silicone, 16 x 8 x 0.125in
- RS Stock No.:
- 282-6833
- Mfr. Part No.:
- GAP PAD TGP HC5000, 16in x 8in x 0.125 sh
- Brand:
- Bergquist
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- RS Stock No.:
- 282-6833
- Mfr. Part No.:
- GAP PAD TGP HC5000, 16in x 8in x 0.125 sh
- Brand:
- Bergquist
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Bergquist | |
| Dimensions | 16 x 8 x 0.125in | |
| Thickness | 0.125in | |
| Length | 16in | |
| Width | 8in | |
| Thermal Conductivity | 5W/m·K | |
| Material | Silicone | |
| Self-Adhesive | Yes | |
| Series | HC5000 | |
Select all | ||
|---|---|---|
Brand Bergquist | ||
Dimensions 16 x 8 x 0.125in | ||
Thickness 0.125in | ||
Length 16in | ||
Width 8in | ||
Thermal Conductivity 5W/m·K | ||
Material Silicone | ||
Self-Adhesive Yes | ||
Series HC5000 | ||
RoHS Status: Exempt
- COO (Country of Origin):
- US
The Bergquist soft and compliant gap filling material with a thermal conductivity of 5.0 W per m K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
High-compliance low compression stress
Fiberglass reinforced for shear and tear resistance
Fiberglass reinforced for shear and tear resistance