Bergquist TGP 2400 Series Self-Adhesive Thermal Gap Pad, 0.01in Thick, 2.4W/m·K, Silicone, 8 x 16 x 0.01in
- RS Stock No.:
- 282-6761
- Mfr. Part No.:
- GAP PAD TGP 2400, 8in x 16in x 0.01
- Brand:
- Bergquist
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- RS Stock No.:
- 282-6761
- Mfr. Part No.:
- GAP PAD TGP 2400, 8in x 16in x 0.01
- Brand:
- Bergquist
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Bergquist | |
Dimensions | 8 x 16 x 0.01in | |
Thickness | 0.01in | |
Length | 8in | |
Width | 16in | |
Thermal Conductivity | 2.4W/m·K | |
Material | Silicone | |
Self-Adhesive | Yes | |
Series | TGP 2400 | |
Select all | ||
---|---|---|
Brand Bergquist | ||
Dimensions 8 x 16 x 0.01in | ||
Thickness 0.01in | ||
Length 8in | ||
Width 16in | ||
Thermal Conductivity 2.4W/m·K | ||
Material Silicone | ||
Self-Adhesive Yes | ||
Series TGP 2400 | ||
RoHS Status: Exempt
- COO (Country of Origin):
- US
The Bergquist Highly Conformable, Thermally Conductive, Reinforced S-Class Gap Filling Material. It is a thermally conductive, reinforced material rated at a thermal conductivity of 2.4 W/m-K . The material is a filled-polymer material yielding extremely soft, elastic characteristics. The material is reinforced to provide easy handling, converting, added electrical isolation and tear resistance.
Ultra conformable
Gel like modulus
Designed for low-stress applications
Gel like modulus
Designed for low-stress applications