Bergquist TGP 2000 Series Self-Adhesive Thermal Gap Pad, 0.02in Thick, 2W/m·K, Silicone, 16 x 8 x 0.02in
- RS Stock No.:
- 282-6743
- Mfr. Part No.:
- GAP PAD TGP 2000, 16in x 8in x 0.02 sh
- Brand:
- Bergquist
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- RS Stock No.:
- 282-6743
- Mfr. Part No.:
- GAP PAD TGP 2000, 16in x 8in x 0.02 sh
- Brand:
- Bergquist
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Bergquist | |
| Dimensions | 16 x 8 x 0.02in | |
| Thickness | 0.02in | |
| Length | 16in | |
| Width | 8in | |
| Thermal Conductivity | 2W/m·K | |
| Material | Silicone | |
| Self-Adhesive | Yes | |
| Series | TGP 2000 | |
Select all | ||
|---|---|---|
Brand Bergquist | ||
Dimensions 16 x 8 x 0.02in | ||
Thickness 0.02in | ||
Length 16in | ||
Width 8in | ||
Thermal Conductivity 2W/m·K | ||
Material Silicone | ||
Self-Adhesive Yes | ||
Series TGP 2000 | ||
RoHS Status: Exempt
- COO (Country of Origin):
- US
The Bergquist Highly Conformable, Thermally Conductive, Reinforced S-Class Gap Filling Material. It is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.
Highly Conformable
Low hardness
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance
Low hardness
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance