RS PRO 18053142-Part Dispensible Thermal Gap Filler, 2.0W/mK Surface cure thermal interface paste specially designed to resist pumping out from the bond line. It can be applied using industrial dispensing equipment or via screen/stencil printing techniques.
Long term thermal stability, recommended for applications with rapid temperature cycling, easily dispensable, fast curing time (when heated). Applications Automotive ECU (electronic control units), power supplies, microprocessors, displays and consumer electronics