Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 180-5314
- Brand:
- RS PRO
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | RS PRO | |
| Thermal Conductivity | 2W/m·K | |
| Material | Silicone | |
| Maximum Operating Temperature | +200°C | |
| Minimum Operating Temperature | -60°C | |
| Physical State | Paste | |
| Pack Size | 200 ml | |
| Operating Temperature Range | -60 → +200 °C | |
Select all | ||
|---|---|---|
Brand RS PRO | ||
Thermal Conductivity 2W/m·K | ||
Material Silicone | ||
Maximum Operating Temperature +200°C | ||
Minimum Operating Temperature -60°C | ||
Physical State Paste | ||
Pack Size 200 ml | ||
Operating Temperature Range -60 → +200 °C | ||
RS PRO 18053142-Part Dispensible Thermal Gap Filler, 2.0W/mK Surface cure thermal interface paste specially designed to resist pumping out from the bond line. It can be applied using industrial dispensing equipment or via screen/stencil printing techniques.
Long term thermal stability,
recommended for applications with rapid temperature cycling,
easily dispensable,
fast curing time (when heated).
Applications
Automotive ECU (electronic control units), power supplies, microprocessors, displays and consumer electronics
recommended for applications with rapid temperature cycling,
easily dispensable,
fast curing time (when heated).
Applications
Automotive ECU (electronic control units), power supplies, microprocessors, displays and consumer electronics