1.5 mm FR4 epoxy, 35 μm CU on both sides Plated drill holes, Ø 1 mm Soldering and component side surface made of chem. nickel/gold (Ni/Au) and solder mask Pre-scored breaking points for detaching individual modules from the board Size 72.6 x 76.2 mm Adaption board for 14 different SMD TSOP I and 7 different SMD TSOP II chips