TDK, VLS-HBX-1, 252012 Shielded Wire-wound SMD Inductor with a Metal Core, 330 nH ±20% Wire-Wound 4.04A Idc
- RS Stock No.:
- 181-5234
- Mfr. Part No.:
- VLS252012HBX-R33M-1
- Brand:
- TDK
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 181-5234
- Mfr. Part No.:
- VLS252012HBX-R33M-1
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Inductance | 330 nH | |
| Maximum DC Current | 4.04A | |
| Package/Case | 252012 | |
| Length | 2.5mm | |
| Depth | 2mm | |
| Height | 1.2mm | |
| Dimensions | 2.5 x 2 x 1.2mm | |
| Shielded | Yes | |
| Tolerance | ±20% | |
| Maximum DC Resistance | 31mΩ | |
| Series | VLS-HBX-1 | |
| Core Material | Metal | |
| Maximum Operating Temperature | +105°C | |
| Inductor Construction | Wire-Wound | |
| Minimum Operating Temperature | -40°C | |
| Select all | ||
|---|---|---|
Brand TDK | ||
Inductance 330 nH | ||
Maximum DC Current 4.04A | ||
Package/Case 252012 | ||
Length 2.5mm | ||
Depth 2mm | ||
Height 1.2mm | ||
Dimensions 2.5 x 2 x 1.2mm | ||
Shielded Yes | ||
Tolerance ±20% | ||
Maximum DC Resistance 31mΩ | ||
Series VLS-HBX-1 | ||
Core Material Metal | ||
Maximum Operating Temperature +105°C | ||
Inductor Construction Wire-Wound | ||
Minimum Operating Temperature -40°C | ||
- COO (Country of Origin):
- CN
Magnetic shield type wound inductor for power circuits using a metallic magnetic material.
High magnetic shield construction and compatible with high-density mounting.
Larger current was achieved by the metallic magnetic material.
APPLICATION
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices, compact power supply modules, other
Application guides: Smart phones/tablets
High magnetic shield construction and compatible with high-density mounting.
Larger current was achieved by the metallic magnetic material.
APPLICATION
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices, compact power supply modules, other
Application guides: Smart phones/tablets