Lead-free, no-clean solder pastes designed for a broad range of applications. Yields excellent print performance across various board designs with excellent fine feature repeatability. The reflowed residues are safe and reliable meeting with the J-STD-004 and Bellcore GR78-CORE test criteria. Also supplied in gel form for solder rework applications.

SAC305 (96.5% Tin, 3.0% silver 0.5% Copper)
Excellent print consistency
Print speeds of up to 200mm/sec
Wide reflow profile window
Excellent solder and flux cosmetics after reflow soldering
Long stencil life and abandon time
IPC 7095 voiding performance classification of Class lll
Halide free material compatible with SM-110 Stencil wipes

ROL0 Designation to ANSI/J-STD-004

Solder Paste - Lead Free