Winbond W97AH2KBVX2I, SDRAM 1Gbit Surface Mount, 400MHz, 134-Pin VFBGA
- RS Stock No.:
- 188-2753
- Mfr. Part No.:
- W97AH2KBVX2I
- Brand:
- Winbond
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 188-2753
- Mfr. Part No.:
- W97AH2KBVX2I
- Brand:
- Winbond
Specifications
Technical Reference
Legislation and Compliance
Product Details
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Select all | Attribute | Value |
|---|---|---|
| Brand | Winbond | |
| Memory Size | 1Gbit | |
| Organisation | 128M x 8 bit | |
| Data Rate | 400MHz | |
| Data Bus Width | 32bit | |
| Number of Bits per Word | 8bit | |
| Number of Words | 128M | |
| Mounting Type | Surface Mount | |
| Package Type | VFBGA | |
| Pin Count | 134 | |
| Dimensions | 11.6 x 10.1 x 0.63mm | |
| Height | 0.63mm | |
| Length | 11.6mm | |
| Minimum Operating Supply Voltage | 1.7 V | |
| Maximum Operating Supply Voltage | 1.95 V | |
| Minimum Operating Temperature | -40 °C | |
| Maximum Operating Temperature | +85 °C | |
| Width | 10.1mm | |
| Select all | ||
|---|---|---|
Brand Winbond | ||
Memory Size 1Gbit | ||
Organisation 128M x 8 bit | ||
Data Rate 400MHz | ||
Data Bus Width 32bit | ||
Number of Bits per Word 8bit | ||
Number of Words 128M | ||
Mounting Type Surface Mount | ||
Package Type VFBGA | ||
Pin Count 134 | ||
Dimensions 11.6 x 10.1 x 0.63mm | ||
Height 0.63mm | ||
Length 11.6mm | ||
Minimum Operating Supply Voltage 1.7 V | ||
Maximum Operating Supply Voltage 1.95 V | ||
Minimum Operating Temperature -40 °C | ||
Maximum Operating Temperature +85 °C | ||
Width 10.1mm | ||
VDD1 = 1.7∼1.95V
VDD2/VDDCA/VDDQ = 1.14V∼1.30V
Data width: x16 / x32
Clock rate: up to 533 MHz
Data rate: up to 1066 Mb/s/pin
Four-bit prefetch DDR architecture
Eight internal banks for concurrent operation
Programmable READ and WRITE latencies (RL/WL)
Programmable burst lengths: 4, 8, or 16
Per Bank Refresh
Partial Array Self-Refresh(PASR)
Deep Power Down Mode (DPD Mode)
Programmable output buffer driver strength
Data mask (DM) for write data
Clock Stop capability during idle periods
Double data rate for data output
Differential clock inputs
Bidirectional differential data strobe
Interface: HSUL_12
Support package:
Single channel: 134 VFBGA (10mm x11.5mm)
Single channel: 168 WFBGA (12mm x12mm)
Operating Temperature Range:
-25°C ≤ TCASE ≤ 85°C
-40°C ≤ TCASE ≤ 85°C
VDD2/VDDCA/VDDQ = 1.14V∼1.30V
Data width: x16 / x32
Clock rate: up to 533 MHz
Data rate: up to 1066 Mb/s/pin
Four-bit prefetch DDR architecture
Eight internal banks for concurrent operation
Programmable READ and WRITE latencies (RL/WL)
Programmable burst lengths: 4, 8, or 16
Per Bank Refresh
Partial Array Self-Refresh(PASR)
Deep Power Down Mode (DPD Mode)
Programmable output buffer driver strength
Data mask (DM) for write data
Clock Stop capability during idle periods
Double data rate for data output
Differential clock inputs
Bidirectional differential data strobe
Interface: HSUL_12
Support package:
Single channel: 134 VFBGA (10mm x11.5mm)
Single channel: 168 WFBGA (12mm x12mm)
Operating Temperature Range:
-25°C ≤ TCASE ≤ 85°C
-40°C ≤ TCASE ≤ 85°C
This is a 1Gb Low Power DDR2 SDRAM organized as 4M words x 8 banks x 32bits.
Burst Type: Sequential or Interleave
Standard Self Refresh Mode
PASR, ATCSR, Power Down Mode、DPD
Programmable output buffer driver strength
Four internal banks for concurrent operation
Bidirectional, data strobe (DQS) is transmitted or received with data, to be used in capturing data at the receiver
Standard Self Refresh Mode
PASR, ATCSR, Power Down Mode、DPD
Programmable output buffer driver strength
Four internal banks for concurrent operation
Bidirectional, data strobe (DQS) is transmitted or received with data, to be used in capturing data at the receiver
