SICK Through Beam Photoelectric Sensor, Cylindrical Sensor, 20 mm Detection Range
- RS Stock No.:
- 285-4403
- Mfr. Part No.:
- UD18-22CC242
- Brand:
- SICK
Subtotal (1 unit)*
£605.44
(exc. VAT)
£726.53
(inc. VAT)
Stock information currently inaccessible
Units | Per unit |
|---|---|
| 1 + | £605.44 |
*price indicative
- RS Stock No.:
- 285-4403
- Mfr. Part No.:
- UD18-22CC242
- Brand:
- SICK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | SICK | |
| Sensor Style | Cylindrical | |
| Detection Type | Through Beam | |
| Detection Range | 20 mm | |
| Output Type | NPN | |
| Electrical Connection | 3-Pin, M5, Male Connector | |
| Maximum DC Voltage | 30V | |
| Terminal Type | 3-Pin, M5, Male Connector | |
| IP Rating | IP65 | |
| Maximum Current | 200 mA | |
| Response Time | 2.5 ms | |
| Housing Material | Metal | |
| Minimum Operating Temperature | +5°C | |
| Maximum Operating Temperature | +60°C | |
| Mounting Type | Threaded | |
| Series | UD18 | |
| Standards Met | CE, EAC | |
| Thread Size | M8 | |
Select all | ||
|---|---|---|
Brand SICK | ||
Sensor Style Cylindrical | ||
Detection Type Through Beam | ||
Detection Range 20 mm | ||
Output Type NPN | ||
Electrical Connection 3-Pin, M5, Male Connector | ||
Maximum DC Voltage 30V | ||
Terminal Type 3-Pin, M5, Male Connector | ||
IP Rating IP65 | ||
Maximum Current 200 mA | ||
Response Time 2.5 ms | ||
Housing Material Metal | ||
Minimum Operating Temperature +5°C | ||
Maximum Operating Temperature +60°C | ||
Mounting Type Threaded | ||
Series UD18 | ||
Standards Met CE, EAC | ||
Thread Size M8 | ||
- COO (Country of Origin):
- DE
Overview
The UD18-2 specializes in checking for double layers and splices using ultrasonic technology. Operating with precision, it is able to determine whether one, two or no material layers are present between its sender and receiver. Where the UD18-2 really excels is checking for double layers in paper, cardboard, shiny metal, and transparent plastic.
It is possible to teach in up to four sensitivity levels and switch between them during operation, allowing the sensor to tackle even the most complex of applications and ensure permanent system availability with a consistently excellent level of production quality.
At a glance
Material classifications: no layers, single layer, double layers
Plug-and-play
Plug-and-play
sensitivity levels that can be selected, taught in, and changed during operation
Up to four individual sensitivity levels
Variable mounting distance
LEDs visible from any direction
Immune to dirt, dust, and humidity
Up to four individual sensitivity levels
Variable mounting distance
LEDs visible from any direction
Immune to dirt, dust, and humidity
Your Benefit
Maximum productivity and quality thanks to reliable material transportation monitoring
Rapid commissioning thanks to plug-and-play plus a range of sensitivity levels to choose from
Easy to switch between sensitivity levels during operation, preventing downtimes during material changes
Individual teach-in of various materials, making it possible to tackle even the most demanding applications
The utmost flexibility during installation thanks to variable mounting distance
LEDs visible from any direction, making it easy to monitor double sheet detections
Reliable detection in dirty, dusty, and humid conditions thanks to the ultrasonic technology's immunity to these environments
Rapid commissioning thanks to plug-and-play plus a range of sensitivity levels to choose from
Easy to switch between sensitivity levels during operation, preventing downtimes during material changes
Individual teach-in of various materials, making it possible to tackle even the most demanding applications
The utmost flexibility during installation thanks to variable mounting distance
LEDs visible from any direction, making it easy to monitor double sheet detections
Reliable detection in dirty, dusty, and humid conditions thanks to the ultrasonic technology's immunity to these environments
Applications
Fields of applications
Double layer detection for paper, cardboard, film, sheet metal, wafers, PCBs, and chip cards
Checking material transportation upstream of presses, printing machines, and cutting machines
Splice and label detection
Packaging, process
Double layer detection for paper, cardboard, film, sheet metal, wafers, PCBs, and chip cards
Checking material transportation upstream of presses, printing machines, and cutting machines
Splice and label detection
Packaging, process
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