SICK Through Beam Photoelectric Sensor, Cylindrical Sensor, 20 mm Detection Range

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Subtotal (1 unit)*

£605.44

(exc. VAT)

£726.53

(inc. VAT)

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RS Stock No.:
285-4403
Mfr. Part No.:
UD18-22CC242
Brand:
SICK
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Brand

SICK

Sensor Style

Cylindrical

Detection Type

Through Beam

Detection Range

20 mm

Output Type

NPN

Electrical Connection

3-Pin, M5, Male Connector

Maximum DC Voltage

30V

Terminal Type

3-Pin, M5, Male Connector

IP Rating

IP65

Maximum Current

200 mA

Response Time

2.5 ms

Housing Material

Metal

Maximum Operating Temperature

+60°C

Series

UD18

Minimum Operating Temperature

+5°C

Mounting Type

Threaded

Standards Met

CE, EAC

Thread Size

M8

COO (Country of Origin):
DE

Overview


The UD18-2 specializes in checking for double layers and splices using ultrasonic technology. Operating with precision, it is able to determine whether one, two or no material layers are present between its sender and receiver. Where the UD18-2 really excels is checking for double layers in paper, cardboard, shiny metal, and transparent plastic.

It is possible to teach in up to four sensitivity levels and switch between them during operation, allowing the sensor to tackle even the most complex of applications and ensure permanent system availability with a consistently excellent level of production quality.

At a glance


Material classifications: no layers, single layer, double layers
Plug-and-play

sensitivity levels that can be selected, taught in, and changed during operation
Up to four individual sensitivity levels
Variable mounting distance
LEDs visible from any direction
Immune to dirt, dust, and humidity

Your Benefit


Maximum productivity and quality thanks to reliable material transportation monitoring
Rapid commissioning thanks to plug-and-play plus a range of sensitivity levels to choose from
Easy to switch between sensitivity levels during operation, preventing downtimes during material changes
Individual teach-in of various materials, making it possible to tackle even the most demanding applications
The utmost flexibility during installation thanks to variable mounting distance
LEDs visible from any direction, making it easy to monitor double sheet detections
Reliable detection in dirty, dusty, and humid conditions thanks to the ultrasonic technology's immunity to these environments

Applications


Fields of applications
Double layer detection for paper, cardboard, film, sheet metal, wafers, PCBs, and chip cards
Checking material transportation upstream of presses, printing machines, and cutting machines
Splice and label detection
Packaging, process

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