onsemi, MICROFJ-60035-TSV-TR1 Si Photodiode, Surface Mount TSV
- RS Stock No.:
- 185-9626
- Mfr. Part No.:
- MICROFJ-60035-TSV-TR1
- Brand:
- onsemi
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 185-9626
- Mfr. Part No.:
- MICROFJ-60035-TSV-TR1
- Brand:
- onsemi
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | onsemi | |
| Package Type | TSV | |
| Mounting Type | Surface Mount | |
| Amplifier Function | No | |
| Number of Pins | 4 | |
| Diode Material | Si | |
| Minimum Wavelength Detected | 200nm | |
| Maximum Wavelength Detected | 900nm | |
| Length | 6.13mm | |
| Width | 6.13mm | |
| Height | 0.46mm | |
| Series | J | |
| Breakdown Voltage | 24.7V | |
Select all | ||
|---|---|---|
Brand onsemi | ||
Package Type TSV | ||
Mounting Type Surface Mount | ||
Amplifier Function No | ||
Number of Pins 4 | ||
Diode Material Si | ||
Minimum Wavelength Detected 200nm | ||
Maximum Wavelength Detected 900nm | ||
Length 6.13mm | ||
Width 6.13mm | ||
Height 0.46mm | ||
Series J | ||
Breakdown Voltage 24.7V | ||
- COO (Country of Origin):
- IE
High-density microcells
J-Series sensors feature ON Semiconductor's unique 'fast output' terminal
Temperature stability of 21.5 mV/°C
Exceptional breakdown voltage uniformity of ±250 mV
Available in a reflow solder compatible TSV chip-scale package
Ultra-low dark count rates of 50 kHz/mm2 typical
Optimized for high-performance timing applications, such as ToF-PET
3 mm, 4 mm and 6 mm sensor sizes
Bias voltage of <30 V
Results in a 50% photon detection efficiency (PDE) at 420 nm
Improved signal rise time and the microcell recovery time
Negates the need for active voltage control
Industry-leading uniformity
TSV package results in almost zero deadspace allowing the creation of high fill factor arrays and is ferrous-metal free
Applications
Medical Imaging
Hazard & Threat
3D Ranging & Sensing
Biophotonics & Sciences
High Energy Physics
J-Series sensors feature ON Semiconductor's unique 'fast output' terminal
Temperature stability of 21.5 mV/°C
Exceptional breakdown voltage uniformity of ±250 mV
Available in a reflow solder compatible TSV chip-scale package
Ultra-low dark count rates of 50 kHz/mm2 typical
Optimized for high-performance timing applications, such as ToF-PET
3 mm, 4 mm and 6 mm sensor sizes
Bias voltage of <30 V
Results in a 50% photon detection efficiency (PDE) at 420 nm
Improved signal rise time and the microcell recovery time
Negates the need for active voltage control
Industry-leading uniformity
TSV package results in almost zero deadspace allowing the creation of high fill factor arrays and is ferrous-metal free
Applications
Medical Imaging
Hazard & Threat
3D Ranging & Sensing
Biophotonics & Sciences
High Energy Physics