Molex PMC Mezzanine Series Straight Surface Mount Edge Connector, 64-Contact, 2-Row, 1mm Pitch, Solder Termination
- RS Stock No.:
- 447-7195P
- Mfr. Part No.:
- 71439-0164
- Brand:
- Molex
Subtotal 1 unit (supplied in a tube)*
£5.02
(exc. VAT)
£6.02
(inc. VAT)
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In Stock
- 28 unit(s) ready to ship
- Plus 999,999,971 unit(s) shipping from 05 February 2026
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Units | Per unit |
---|---|
1 + | £5.02 |
*price indicative
- RS Stock No.:
- 447-7195P
- Mfr. Part No.:
- 71439-0164
- Brand:
- Molex
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Molex | |
Number of Contacts | 64 | |
Number of Rows | 2 | |
Pitch | 1mm | |
Type | Board to Board | |
Mounting Type | Surface Mount | |
Body Orientation | Straight | |
Termination Method | Solder | |
Current Rating | 12A | |
Voltage Rating | 100 V | |
Series | PMC Mezzanine | |
Contact Material | Bronze | |
Series Number | 71439 | |
Select all | ||
---|---|---|
Brand Molex | ||
Number of Contacts 64 | ||
Number of Rows 2 | ||
Pitch 1mm | ||
Type Board to Board | ||
Mounting Type Surface Mount | ||
Body Orientation Straight | ||
Termination Method Solder | ||
Current Rating 12A | ||
Voltage Rating 100 V | ||
Series PMC Mezzanine | ||
Contact Material Bronze | ||
Series Number 71439 | ||
- COO (Country of Origin):
- US
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component