Molex PMC Mezzanine Series Straight Surface Mount PCB Header, 64 Contact(s), 1.0mm Pitch, 2 Row(s), Shrouded
- RS Stock No.:
- 670-6482P
- Mfr. Part No.:
- 71436-0864
- Brand:
- Molex
Bulk discount available
Subtotal 20 units (supplied on a continuous strip)*
£146.80
(exc. VAT)
£176.20
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 02 March 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 20 - 74 | £7.34 |
| 75 - 299 | £6.99 |
| 300 + | £5.92 |
*price indicative
- RS Stock No.:
- 670-6482P
- Mfr. Part No.:
- 71436-0864
- Brand:
- Molex
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Series | PMC Mezzanine | |
| Pitch | 1.0mm | |
| Number of Contacts | 64 | |
| Number of Rows | 2 | |
| Body Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Mounting Type | Surface Mount | |
| Connector System | Board to Board | |
| Termination Method | Solder | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Series Number | 71436 | |
| Current Rating | 1.0A | |
| Voltage Rating | 100.0 V | |
Select all | ||
|---|---|---|
Brand Molex | ||
Series PMC Mezzanine | ||
Pitch 1.0mm | ||
Number of Contacts 64 | ||
Number of Rows 2 | ||
Body Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mounting Type Surface Mount | ||
Connector System Board to Board | ||
Termination Method Solder | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Series Number 71436 | ||
Current Rating 1.0A | ||
Voltage Rating 100.0 V | ||
- COO (Country of Origin):
- US
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component