Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• Plastic peg PCB locks for secure connection to PCB
• Glow Wire Compliant

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals

This PCB header is specifically designed for efficient wire-to-board connections. It features a right-angle orientation and comes equipped with four circuits to accommodate various electrical needs. The shrouded design enhances security against accidental disengagement, making it suitable for automated applications in the electrical and mechanical industries.

• Compatible with surface mount applications for versatile integration
• Shrouded design prevents misalignment during connection
• High-temperature thermoplastic ensures durability under extreme conditions
• Supports up to 8.5A current rating for reliable performance
• Through-hole termination method simplifies installation process
• Glow wire compliant for enhanced safety in high-heat environments

• Ideal for power distribution in electronic devices
• Suitable for connections in automation equipment
• Utilised in consumer electronics for reliable power transfer
• Employed in control systems requiring robust interconnection

The ideal PCB thickness for this connector is 1.60mm, ensuring secure mounting and electrical reliability.

The shrouded design enhances the connector's stability, reducing the risk of misalignment and ensuring a secure fit during operation.

It can be used in both SMC and wave solder processes, allowing for flexibility during assembly.

It is capable of operating within a temperature range of -40°C to +105°C, making it suitable for various environments.

The contacts are plated with tin, which provides good conductivity and resistance to corrosion, ensuring long-lasting performance in demanding applications.

Molex Micro-Fit 3.0 Series