Molex Micro-Fit 3.0 Series Vertical Surface PCB Header, 5 Contact(s), 3 mm Pitch, 1 Row(s), Shrouded

Subtotal 5 units (supplied on a continuous strip)*

£11.16

(exc. VAT)

£13.39

(inc. VAT)

Add to Basket
Select or type quantity
In Stock
  • 320 unit(s) ready to ship
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units
Per unit
5 +£2.232

*price indicative

Packaging Options:
RS Stock No.:
670-2193P
Mfr. Part No.:
43650-0524
Brand:
Molex
Find similar products by selecting one or more attributes.
Select all

Brand

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

5A

Number of Contacts

5

Housing Material

Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Connector System

Wire-to-Board

Contact Plating

Tin

Contact Material

Brass

Row Pitch

3mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

105°C

Standards/Approvals

No

Voltage

250 V

Distrelec Product Id

304-56-321

Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series


Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Solder tabs for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series