Amphenol Communications Solutions Bergstik Series Surface Mount Pin Header, 3 Contact(s), 2.54mm Pitch, 1 Row(s),
- RS Stock No.:
- 236-4717P
- Mfr. Part No.:
- 95293-101A03LF
- Brand:
- Amphenol Communications Solutions
Bulk discount available
Subtotal 50 units (supplied on a continuous strip)*
£26.45
(exc. VAT)
£31.75
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- Plus 1,000 unit(s) shipping from 13 October 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 50 - 90 | £0.529 |
| 100 + | £0.499 |
*price indicative
- RS Stock No.:
- 236-4717P
- Mfr. Part No.:
- 95293-101A03LF
- Brand:
- Amphenol Communications Solutions
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol Communications Solutions | |
| Series | Bergstik | |
| Pitch | 2.54mm | |
| Number of Contacts | 3 | |
| Number of Rows | 1 | |
| Shrouded/Unshrouded | Unshrouded | |
| Mounting Type | Surface Mount | |
Select all | ||
|---|---|---|
Brand Amphenol Communications Solutions | ||
Series Bergstik | ||
Pitch 2.54mm | ||
Number of Contacts 3 | ||
Number of Rows 1 | ||
Shrouded/Unshrouded Unshrouded | ||
Mounting Type Surface Mount | ||
- COO (Country of Origin):
- FR
The Amphenol ICC BergStik unshrouded header has 2.54 mm pitch provide board-to-board, wire-to-board and cable-to-board interconnect solutions for all types of electronic equipment and devices.
High temperature thermoplastic material
Reflow compatible
Variable spacing height for stacking headers
Cater to a wide range of applications
Allow dual entry, mating from top or bottom
Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
Reflow compatible
Variable spacing height for stacking headers
Cater to a wide range of applications
Allow dual entry, mating from top or bottom
Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements