Phoenix Contact Straight Solder Mount PCB Header, 12 Contact(s), 3.81mm Pitch, 1 Row(s), Shrouded

Subtotal (1 pack of 50 units)*

£364.18

(exc. VAT)

£437.02

(inc. VAT)

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RS Stock No.:
567-341
Mfr. Part No.:
1707735
Brand:
Phoenix Contact
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Brand

Phoenix Contact

Pitch

3.81mm

Number of Contacts

12

Number of Rows

1

Body Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mounting Type

Solder Mount

COO (Country of Origin):
DE

AVX 1206 MLCC Series


X7R formulations are called “temperature stable” ceramics and fall into EIA Class II materials, and COG (NPO) is the most popular “temperature-compensating” EIA Class I ceramic materials

Multilayer Ceramic Capacitors whose temperature variation is within ±15% from -55°C to +125°C
The capacitance change is non-linear
AVX high voltage chips have advantages of high value, low leakage and small size, thus applications include as snubbers in high frequency power converters, resonators in SMPS and high voltage coupling/DC blocking
These high voltage chip designs exhibit low ESRs at high frequencies

The Phoenix Contact PCB Header offers an innovative solution for reliable electrical connections in various applications. Designed for through-hole reflow technology, it is well-suited for modern automated manufacturing processes. The header's robust construction allows for a nominal current of 8 A and a rated voltage of up to 160 V, making it suitable for a broad range of uses within industrial environments.

Ideal for multi row arrangements maximising PCB space utilisation
Moisture sensitivity level 1 ensures reliable performance in humid conditions
RoHS compliant demonstrating a commitment to environmentally friendly practices


1206 Range


C0G (NP0) is the most popular formulation of the "temperature-compensating", EIA Class I ceramic materials
X7R formulations are called "temperature stable" ceramics and fall into EIA Class II materials
Y5V formulations are for general-purpose use in a limited temperature range.These characteristics make Y5V ideal for decoupling applications

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