Molex 503308 Series Vertical Surface Mount PCB Header, 0.4mm Pitch, 2 Row(s), Unshrouded
- RS Stock No.:
- 472-009
- Mfr. Part No.:
- 503308-4410
- Brand:
- Molex
Subtotal (1 reel of 3000 units)*
£4,509.42
(exc. VAT)
£5,411.30
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 26 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Reel(s) | Per Reel | Per unit* |
---|---|---|
1 + | £4,509.42 | £1.503 |
*price indicative
- RS Stock No.:
- 472-009
- Mfr. Part No.:
- 503308-4410
- Brand:
- Molex
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Molex | |
Series | 503308 | |
Pitch | 0.4mm | |
Number of Rows | 2 | |
Body Orientation | Vertical | |
Shrouded/Unshrouded | Unshrouded | |
Mounting Type | Surface Mount | |
Select all | ||
---|---|---|
Brand Molex | ||
Series 503308 | ||
Pitch 0.4mm | ||
Number of Rows 2 | ||
Body Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Mounting Type Surface Mount | ||
- COO (Country of Origin):
- JP
The TE Connectivity board-to-board connector is designed to deliver exceptional reliability and performance for modern electronic applications. With a slim 0.40mm pitch, this connector ensures a compact footprint while maintaining robust functionality. It is tailored for surface mount technology, featuring dual rows that facilitate vertical stacking with precise alignment. The connector boasts a stacking height option of 0.70mm or 1.00mm, accommodating various design constraints. Built with copper alloy and gold plating, it ensures optimal conductivity and durability, making it suitable for harsh environments. The product is compliant with RoHS and REACH regulations, confirming its adherence to environmental standards, which is critical for manufacturers looking to meet global compliance requirements. Overall, this connector combines innovation with high performance, ensuring it meets the demands of contemporary electronic systems.
Compact design enhances space utilisation in electronic assemblies
Optimised for seamless integration with board-to-board applications
Durable construction ensures long-lasting performance under varying conditions
Dual row configuration provides enhanced connectivity options
Meets international compliance standards, ensuring environmental responsibility
Gold-plated contacts prevent corrosion and ensure reliable connectivity
Suitable for high-density applications with 44 circuits maximum capacity
Vertical orientation simplifies layout and design processes
Optimised for seamless integration with board-to-board applications
Durable construction ensures long-lasting performance under varying conditions
Dual row configuration provides enhanced connectivity options
Meets international compliance standards, ensuring environmental responsibility
Gold-plated contacts prevent corrosion and ensure reliable connectivity
Suitable for high-density applications with 44 circuits maximum capacity
Vertical orientation simplifies layout and design processes