The ISM330DLC is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

3D accelerometer with selectable full scale
3D gyroscope with selectable full scale
Dedicated gyroscope output chain with low latency, low noise and dedicated low-pass filters
Embedded hard, soft ironing for external magnetic sensor corrections
Embedded temperature sensor
High shock survivability