OIS-150-770-X-T EPIGAP OSA Photonics, OIS-150 770nm IR LED, 1206 SMD package
- RS Stock No.:
- 173-6294P
- Mfr. Part No.:
- OIS-150-770-X-T
- Brand:
- EPIGAP OSA Photonics
Bulk discount available
Subtotal 100 units (supplied on a continuous strip)*
£61.50
(exc. VAT)
£73.80
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- 1,200 unit(s) ready to ship
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 100 - 240 | £0.615 |
| 250 - 490 | £0.597 |
| 500 - 990 | £0.578 |
| 1000 + | £0.562 |
*price indicative
- RS Stock No.:
- 173-6294P
- Mfr. Part No.:
- OIS-150-770-X-T
- Brand:
- EPIGAP OSA Photonics
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | EPIGAP OSA Photonics | |
| Peak Wavelength | 770nm | |
| Package Type | 1206 | |
| Radiant Intensity | 2.8mW/sr | |
| Mounting Type | Surface Mount | |
| Number of LEDs | 1 | |
| Number of Pins | 2 | |
| Dimensions | 3.2 x 1.6 x 1.2mm | |
| Lens Shape | Square | |
| Series | OIS-150 | |
| LED Material | AlInGaP, GaAlAs, GaP, InGaN | |
| Maximum Supply Voltage | 2V | |
Select all | ||
|---|---|---|
Brand EPIGAP OSA Photonics | ||
Peak Wavelength 770nm | ||
Package Type 1206 | ||
Radiant Intensity 2.8mW/sr | ||
Mounting Type Surface Mount | ||
Number of LEDs 1 | ||
Number of Pins 2 | ||
Dimensions 3.2 x 1.6 x 1.2mm | ||
Lens Shape Square | ||
Series OIS-150 | ||
LED Material AlInGaP, GaAlAs, GaP, InGaN | ||
Maximum Supply Voltage 2V | ||
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.2mm
view angle: 140°
technology: GaP, AlInGaP, GaAlAs and InGaN
(un)colored, (un)diffused encapsulation available
soldering pads: gold plated
suitable for all SMT assembly methods
size: 3.2mm x 1.6mm x 1.2mm
view angle: 140°
technology: GaP, AlInGaP, GaAlAs and InGaN
(un)colored, (un)diffused encapsulation available
soldering pads: gold plated
suitable for all SMT assembly methods
View angle 40°
package: 1206
size: 3.2mm x 1.6mm x 1.2mm
circuit substrate: glass laminated epoxy
Lead free solderable, soldering pads:gold plated
taped in 8 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
package: 1206
size: 3.2mm x 1.6mm x 1.2mm
circuit substrate: glass laminated epoxy
Lead free solderable, soldering pads:gold plated
taped in 8 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
