Amphenol Communications Solutions SMD Prototyping IC Socket
- RS Stock No.:
- 182-2753P
- Mfr. Part No.:
- 74221-101LF
- Brand:
- Amphenol Communications Solutions
Save 7% when you buy 100 units
Subtotal 10 units (supplied on a continuous strip)*
£285.10
(exc. VAT)
£342.10
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 12 March 2026
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Units | Per unit |
|---|---|
| 10 - 24 | £28.51 |
| 25 - 49 | £27.76 |
| 50 - 99 | £27.02 |
| 100 + | £26.32 |
*price indicative
- RS Stock No.:
- 182-2753P
- Mfr. Part No.:
- 74221-101LF
- Brand:
- Amphenol Communications Solutions
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol Communications Solutions | |
| IC Socket Type | Prototyping Socket | |
| Package Type | SMD | |
Select all | ||
|---|---|---|
Brand Amphenol Communications Solutions | ||
IC Socket Type Prototyping Socket | ||
Package Type SMD | ||
- COO (Country of Origin):
- US
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free