Amphenol FCI SMD Prototyping Socket

Technical Reference
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): US
Product Details

High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options

81 Position BGA Plug, 0 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free

Specifications
Attribute Value
Package Type SMD
IC Socket Type Prototyping Socket
250 In stock - FREE next working day delivery available
Price Each
£ 9.76
(exc. VAT)
£ 11.71
(inc. VAT)
Units
Per unit
1 +
£9.76
Packaging Options:
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