Winslow Straight Through Hole Mount 1.27 mm, 2.54 mm Pitch IC Socket Adapter, 44 Pin Female SOP to 44 Pin Male DIP
- RS Stock No.:
- 741-9442
- Mfr. Part No.:
- W9521RC
- Brand:
- Winslow
Image representative of range
Bulk discount available
Subtotal (1 unit)*
£38.63
(exc. VAT)
£46.36
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- 9 unit(s) shipping from 06 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 24 | £38.63 |
| 25 - 74 | £34.76 |
| 75 - 199 | £30.90 |
| 200 - 399 | £27.04 |
| 400 + | £25.11 |
*price indicative
- RS Stock No.:
- 741-9442
- Mfr. Part No.:
- W9521RC
- Brand:
- Winslow
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Pitch | 1.27 mm, 2.54 mm | |
| End 1 | 44 Pin Female SOP | |
| End 2 | 44 Pin Male DIP | |
| End 1 Number of Contacts | 44 | |
| End 2 Number of Contacts | 44 | |
| End 1 Type | SOP | |
| End 2 Type | DIP | |
| End 1 Gender | Female | |
| End 2 Gender | Male | |
| Mounting Type | Through Hole | |
| Body Orientation | Straight | |
| Contact Material | Brass | |
| Contact Plating | Tin over Nickel | |
| Housing Material | FR4 | |
Select all | ||
|---|---|---|
Brand Winslow | ||
Pitch 1.27 mm, 2.54 mm | ||
End 1 44 Pin Female SOP | ||
End 2 44 Pin Male DIP | ||
End 1 Number of Contacts 44 | ||
End 2 Number of Contacts 44 | ||
End 1 Type SOP | ||
End 2 Type DIP | ||
End 1 Gender Female | ||
End 2 Gender Male | ||
Mounting Type Through Hole | ||
Body Orientation Straight | ||
Contact Material Brass | ||
Contact Plating Tin over Nickel | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOIC to DIP Sockets
Adaptics’ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.