RS PRO Heatsink, Universal Rectangular Alu, 22K/W, 23 x 23 x 6mm, Adhesive Foil

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Subtotal (1 bag of 5 units)*

£8.10

(exc. VAT)

£9.72

(inc. VAT)

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  • 215 unit(s) ready to ship
  • Plus 32 unit(s) ready to ship from another location
  • Plus 222 unit(s) shipping from 11 December 2025
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Per unit*
1 - 9£8.10£1.62
10 - 24£7.45£1.49
25 - 49£7.14£1.428
50 - 99£6.87£1.374
100 +£6.31£1.262

*price indicative

RS Stock No.:
750-0894
Distrelec Article No.:
304-04-855
Brand:
RS PRO
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Brand

RS PRO

For Use With

Universal Rectangular Alu

Length

23mm

Width

23mm

Height

6mm

Dimensions

23 x 23 x 6mm

Thermal Resistance

22K/W

Mounting

Adhesive Foil

Colour

Black

Package Type

BGA

Application

Semiconductor Devices

Material

Aluminium

Finish

Anodized

COO (Country of Origin):
GB

BGA Heatsink, Standard


Standard type BGA heatsink suitable for a variety of applications.

RS PRO Heatsink - Adhesive Foil, 23 mm x 23 mm x 6 mm


The RS PRO standard BGA (Ball Grid Array) Push Pin heatsink is meticulously designed for superior performance and precision, seamlessly integrating into your electronic systems. This heatsink serves as a crucial element in preventing circuits from overheating, thereby ensuring the consistent and reliable performance of your electronic devices.

Crafted from aluminium with a durable anodized finish, this heatsink offers excellent heat dissipation capabilities. Its secure mounting, facilitated by adhesive foil, provides a stable and efficient connection to electronic components.

Why Would You Choose This Heatsink?


The RS PRO Heatsink plays a vital role in maintaining optimal operating temperatures for your electronic components, safeguarding them against the risks of overheating. As electronic components generate heat during operation, the heatsink effectively absorbs and dissipates this heat, preventing the accumulation that could otherwise lead to damage or a decline in component performance. Invest in the RS PRO Heatsink for enhanced thermal management and prolonged durability of your electronic devices.

Features and Benefits


  • BGA heatsink

  • Standard, Pushpin

  • Made from aluminium

  • Adhesive foil mounting

  • Anodized finish

  • For use with Universal rectangular Alu

  • Thermal resistance 22.0° C/W

Dimensions


  • 23 mm x 23 mm x 6mm

Applications


  • Integrated Circuits

  • PCB


BGA Heatsinks