Heatsink, BGA, 27K/W, 13 x 13.5 x 10mm, Adhesive Foil

Technical Reference
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): GB
Product Details

BGA Heatsink, Standard

Standard type BGA heatsink suitable for a variety of applications.

BGA Heatsinks

Specifications
Attribute Value
For Use With BGA
Length 13mm
Width 13.5mm
Height 10mm
Dimensions 13 x 13.5 x 10mm
Thermal Resistance 27K/W
Mounting Adhesive Foil
Colour Black
328 In stock for FREE next working day delivery
Price 1 Bag of 5
£ 5.07
(exc. VAT)
£ 6.08
(inc. VAT)
Bag(s)
Per Bag
Per unit*
1 - 49
£5.07
£1.014
50 - 99
£4.53
£0.906
100 - 249
£3.97
£0.794
250 - 499
£3.44
£0.688
500 +
£3.31
£0.662
*price indicative
Related Products
ABL design their heat sinks to increase the ...
Description:
ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices ...
ICK BGA series of heatsinks have been designed ...
Description:
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included). Features and BenefitsBlack anodised surface.Heatsink dimensions match respective BGA-type.Can be affixed directly on to the BGA component with thermal adhesive or conductive foil ...
Round heatsinks for ICs, which are also designed ...
Description:
Round heatsinks for ICs, which are also designed for use with LEDs (see also ICK LED R heatsinks, typical SN 674-4771 ). Al-natural surfaceMounting by clamp, foil or adhesive.
ABL design their heat sinks to increase the ...
Description:
ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices ...