Heatsink, BGA, 27K/W, 13 x 13.5 x 10mm, Adhesive Foil

Technical Reference
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): GB
Product Details

BGA Heatsink, Standard

Standard type BGA heatsink suitable for a variety of applications.

BGA Heatsinks

Specifications
Attribute Value
For Use With BGA
Length 13mm
Width 13.5mm
Height 10mm
Dimensions 13 x 13.5 x 10mm
Thermal Resistance 27K/W
Mounting Adhesive Foil
Colour Black
255 In stock for FREE next working day delivery
Price 1 Bag of 5
£ 5.07
(exc. VAT)
£ 6.08
(inc. VAT)
Bag(s)
Per Bag
Per unit*
1 - 49
£5.07
£1.014
50 - 99
£4.53
£0.906
100 - 249
£3.97
£0.794
250 - 499
£3.44
£0.688
500 +
£3.31
£0.662
*price indicative
Related Products
A range of BGA heatsinks with thermally conductive ...
Description:
A range of BGA heatsinks with thermally conductive adhesive tape mounting. Tape mounting saves board space by eliminating mounting holesConvenient peel and stick assembly is quick and cleanPin Fin array allows omni-directional airflow to maximize heat dissipation.
Aluminium heatsink solution with plastic clips, and phase ...
Description:
Aluminium heatsink solution with plastic clips, and phase change thermal interface material for heat removal on BGA packages and similar heat sources. Low profileBase thickness 1.7mmBlack anodised finishPlastic clip for simple attachment to BGAHigh performance phase change already appliedSupplied with a blue clip.
Black anodisedThe kit box option (5040766) contains a ...
Description:
Black anodisedThe kit box option (5040766) contains a range of SMD heatsinks with anodised and solderable surfaces. • Mounting method: thermal adhesive or conductive foil (not included).
ICK BGA series of heatsinks have been designed ...
Description:
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included). Features and BenefitsBlack anodised surface.Heatsink dimensions match respective BGA-type.Can be affixed directly on to the BGA component with thermal adhesive or conductive foil ...