Heatsink, Universal Rectangular Alu, 63K/W, 13 x 6.3 x 4.8mm, Conductive Adhesive, Conductive Foil

Technical Reference
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): DE
Product Details

SMD Heatsinks

Black anodised
The kit box option (5040766) contains a range of SMD heatsinks with anodised and solderable surfaces.
• Mounting method: thermal adhesive or conductive foil (not included)

Specifications
Attribute Value
For Use With Universal Rectangular Alu
Length 13mm
Width 6.3mm
Height 4.8mm
Dimensions 13 x 6.3 x 4.8mm
Thermal Resistance 63K/W
Mounting Conductive Adhesive, Conductive Foil
Colour Black
Package Type DIL-IC
570 in stock for FREE next working day delivery
3300 available from Europe for delivery within 1 working day(s)
Price Each (In a Pack of 10)
£ 0.359
(exc. VAT)
£ 0.431
(inc. VAT)
Units
Per unit
Per Pack*
10 - 90
£0.359
£3.59
100 - 240
£0.324
£3.24
250 - 490
£0.317
£3.17
500 - 990
£0.301
£3.01
1000 +
£0.288
£2.88
*price indicative
Related Products
A range of BGA heatsinks with thermally conductive ...
Description:
A range of BGA heatsinks with thermally conductive adhesive tape mounting. Tape mounting saves board space by eliminating mounting holesConvenient peel and stick assembly is quick and cleanPin Fin array allows omni-directional airflow to maximize heat dissipation.
The LA ICK series heatsinks stand out due ...
Description:
The LA ICK series heatsinks stand out due to the following characteristics:. Particularly high-quality designIntegrated fan (12 V), allowing a very low height profile17 x 17 pin matrix suitable for processor 80486Fan motor with dual ball bearing mounted axis, ensuring a high level of operational safety and a long service ...
ICK BGA series of heatsinks have been designed ...
Description:
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included). Features and BenefitsBlack anodised surface.Heatsink dimensions match respective BGA-type.Can be affixed directly on to the BGA component with thermal adhesive or conductive foil ...
High power (HP) and high brightness (HB) LEDs ...
Description:
High power (HP) and high brightness (HB) LEDs need efficient heat dissipation to facilitate trouble-free functioning, good light yield and long service life. The shape or location of lamps and their housings is often rotationally asymmetric, so that a round body is the appropriate heatsink shape. Fischer has developed ICK ...