Transcend MTE370T M.2 (2230) 256 GB Internal SSD
- RS Stock No.:
- 262-9711
- Mfr. Part No.:
- TS256GMTE370T
- Brand:
- Transcend
Subtotal (1 unit)*
£69.45
(exc. VAT)
£83.34
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- 3 unit(s) ready to ship
- Plus 18 unit(s) ready to ship from another location
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Units | Per unit |
|---|---|
| 1 + | £69.45 |
*price indicative
- RS Stock No.:
- 262-9711
- Mfr. Part No.:
- TS256GMTE370T
- Brand:
- Transcend
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Transcend | |
| Model | MTE370T | |
| Hard Drive Type | SSD | |
| Internal/External | Internal | |
| Industrial | Yes | |
| Form Factor | M.2 (2230) | |
| Capacity | 256 GB | |
| Interface | NVMe PCIe Gen 3 x 4 | |
| Nand Type | 3D TLC | |
Select all | ||
|---|---|---|
Brand Transcend | ||
Model MTE370T | ||
Hard Drive Type SSD | ||
Internal/External Internal | ||
Industrial Yes | ||
Form Factor M.2 (2230) | ||
Capacity 256 GB | ||
Interface NVMe PCIe Gen 3 x 4 | ||
Nand Type 3D TLC | ||
RoHS Status: Exempt
Transcend 256GB M.2 2230 PCIe gen3 x4 SSD - MTE370T
Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D
NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The
MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3
specifications to achieve never-before-seen transfer speeds. Applied with the 30μ" gold finger PCB and Corner Bond
technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an
endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃∼75℃.
NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The
MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3
specifications to achieve never-before-seen transfer speeds. Applied with the 30μ" gold finger PCB and Corner Bond
technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an
endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃∼75℃.
Hardware Features
Compliant with RoHS 2.0 standards Compliant with NVM Express specification 1.3 Compliant with PCI Express specification 3.1 Space-saving M.2 form factor (30mm) – ideal for mobile computing devices Single-sided to fit perfectly in small form factor devices
Firmware Features
Supports NVM command SLC caching technology Dynamic thermal throttling Built-in LDPC ECC (Error Correction Code) functionality Advanced Garbage Collection