STMicroelectronics B-L462E-CELL1 Discovery kit is a turnkey development platform for cellular IoT devices. The Discovery kit contains a low-power Discovery main board powered by an LBAD0ZZ1SE module, a global coverage antenna, and a fan-out board. The LBAD0ZZ1SE module includes an STM32L462REY6TR microcontroller, an LBAD0XX1SC-DM ultra-small LTE Cat M/NB modem, and an ST4SIM-200M GSMA-certified embedded SIM with a prepaid cellular connectivity data plane. ST4SIM-200M can also be used as an embedded secure element (eSE) for application.

STMod+ and extended pins connectivity provide unlimited expansion capabilities with a large choice of specialized add-on boards. Moreover, the fan-out board supports add-on boards using mikroBUS, ESP‑01, Grove I²C, Grove UART, and breadboard. The B-L462E-CELL1 Discovery kit includes an ST-LINK debugger/programmer and comes with the comprehensive STM32Cube software libraries together with packaged software examples to demonstrate end-to-end connectivity.

LBAD0ZZ1SE module from Murata powered by STM32L462RE with built-in eSIM (ST4SIM-200M), LTE Cat M/NBIoT modem (LBAD0XX1SC-DM), and 1 Mbyte of Quad-SPI Flash memory

Ultra-low-power STM32L4 Series STM32L462REY6TR microcontroller based on the Arm® Cortex®-M4 core with 512 Kbytes of Flash memory and 160 Kbytes of RAM in a WLCSP64 package

64 Mbytes of onboard Quad-SPI Flash memory from Micron®, exclusive with the 1 MByte of Quad-SPI Flash memory inside the module

16 Kbytes of I²C EEPROM (M24128-DFMN6TP) from STMicroelectronics

0.96-inch 128 x 64 OLED screen with SPI interface

Low-power Audio CODEC with PCM bus and I²C interface (MAX9867ETJ+ from Maxim)

Ultra-low-power 3D accelerometer and 3D magnetometer (LSM303AGR) from STMicroelectronics

Capacitive digital sensor for relative humidity and temperature (HTS221) from STMicroelectronics

260-1260 hPa absolute digital output barometer (LPS22HH) from STMicroelectronics

3 user LEDs

2 push-buttons (user and reset)

Board connectors:

• SMA antenna connector

• Two 50-pin 2.54 mm pitch headers

• STMod+

• micro-SIM card slot

• 3.5 mm CTIA stereo headset jack including analog microphone input

• USB Micro-B connectors for power, USARTs, USB device, and ST-LINK/V2-1

• TAG10

• mikroBUS expansion connectors

• ESP‑01 expansion connector

• Grove Seeed Studio™ breadboard, I²C, and UART expansion connectors

Flexible power-supply options: ST-LINK USB, User USB, UART USB, Power USB, or three AAA batteries

On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: mass storage, Virtual COM port, and debug port

End-to-end connectivity applications

Low‑power cellular network services from Truphone®

Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE