Vero Technologies 96 Way Backplane Epoxy Glass Fabric Laminate 2 84 HP With 15.24 mm Connector Pitch

RS Stock No.:: 435-068
Mfr. Part No.:: 222-2470
Brand:: Vero Technologies

Vero Technologies 96 Way Backplane Epoxy Glass Fabric Laminate 2 84 HP With 15.24 mm Connector Pitch

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Subtotal (1 unit)*

£223.10

(exc. VAT)

£267.72

(inc. VAT)

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In Stock

1 unit(s) ready to ship

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Units	Per unit
1 - 4	£223.10
5 - 9	£211.95
10 - 49	£200.79
50 +	£189.63

*price indicative

RS Stock No.:: 435-068
Mfr. Part No.:: 222-2470
Brand:: Vero Technologies

Specifications

Technical Reference

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Vero Technologies
	Product Type	Backplane
	Number of Contacts	96
	Sub Type	Microbus Backplanes
	Board Material	Epoxy Glass Fabric Laminate
	Number of Sides	2
	Horizontal Pitch	84HP
	Pitch	15.24mm
	Copper Thickness	35μm
	External Width	20mm
	Board Thickness	1.6mm
	External Height	130mm
	Standards/Approvals	RoHS, EP-GC-Cu3 FR4, BS 4584

	Select all
	Brand Vero Technologies
	Product Type Backplane
	Number of Contacts 96
	Sub Type Microbus Backplanes
	Board Material Epoxy Glass Fabric Laminate
	Number of Sides 2
	Horizontal Pitch 84HP
	Pitch 15.24mm
	Copper Thickness 35μm
	External Width 20mm
	Board Thickness 1.6mm
	External Height 130mm
	Standards/Approvals RoHS, EP-GC-Cu3 FR4, BS 4584

Datasheet - 222-2470

COO (Country of Origin):: GB

Eurocard Backplanes, Double-Sided

Double sided backplanes 3U high with pth for high reliability which will accept DIN41612 connectors. Suitable for use with subracks to IEC297-3.

96//96-way suitable for high speed logic systems where screening is required between each signal line. Can also be used for slower applications with a maximum of 84 seperate signal lines by breaking the 0V commoning line in the end position

PC / VME Bus Boards

PC Compatible Prototyping Boards

Prototyping boards manufactured from epoxy glass material to BS 4584 part 3 or 16. Card thickness is 1.6 mm. Copper is 305 g/m² (1 oz/ft²). Edge connector fingers are gold plated to a thickness of 1.5 microns. 1.0 mm (0.040 in.). Diameter holes are pre-drilled on a 2.54 mm (0.1 in.) matrix.

Microboard Pattern

Incorporates, on the component side of the card, a colander ground plane for maximum screening and glitch free high speed operation, and complete solder mask protection.

Supplied with

2 insulated mounting strips