Thermal Grease

Thermal grease is known by a number of names including:
• CPU grease
• heat paste
• heat sink compound or paste
• thermal compound, gel or paste
• thermal interface material.
It is a thermally conductive material which is usually electrically insulating which helps to dissipate heat from a device. Its main function is to ensure there is no air space between which would act as a thermal insulator. It fills in the microscopic imperfections on the heatsink and device.
It is most commonly used between a CPU and a heat sink to maximise heat transfer. It is also used on other electronic components which create heat and also need a heat sink such as MOSFET transistors.
There are other types of products to eliminate the air gap under a heat sink:
• Thermal Adhesive
• Thermal Gap Pads

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Description Price Thermal Conductivity Material Maximum Operating Temperature Minimum Operating Temperature Pack Size Chemical Component Operating Temperature Range Physical State
RS Stock No. 665-4855
Mfr. Part No.CW7250
1.85W/m·K Boron Nitride +200°C -73°C 8g - -73 → +200 °C -
RS Stock No. 665-4846
Mfr. Part No.CW7270
0.71W/m·K Non-Silicone +200°C -15°C 8g - -15 → +200 °C -
RS Stock No. 277-8200
Mfr. Part No.CT40-5
0.63W/m·K Silicone +317°C -46°C 142g - -46 → +317 °C -