TDK, VLS-HBX-1, 201610 Shielded Wire-wound SMD Inductor with a Metal Core, 680 nH ±20% Wire-Wound 2.47A Idc
- RS Stock No.:
- 181-4886
- Mfr. Part No.:
- VLS201610HBX-R68M-1
- Brand:
- TDK
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 181-4886
- Mfr. Part No.:
- VLS201610HBX-R68M-1
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TDK | |
Inductance | 680 nH | |
Maximum DC Current | 2.47A | |
Package/Case | 201610 | |
Length | 2mm | |
Depth | 1.6mm | |
Height | 1mm | |
Dimensions | 2 x 1.6 x 1mm | |
Shielded | Yes | |
Tolerance | ±20% | |
Maximum DC Resistance | 53mΩ | |
Series | VLS-HBX-1 | |
Core Material | Metal | |
Minimum Operating Temperature | -40°C | |
Maximum Operating Temperature | +105°C | |
Inductor Construction | Wire-Wound | |
Select all | ||
---|---|---|
Brand TDK | ||
Inductance 680 nH | ||
Maximum DC Current 2.47A | ||
Package/Case 201610 | ||
Length 2mm | ||
Depth 1.6mm | ||
Height 1mm | ||
Dimensions 2 x 1.6 x 1mm | ||
Shielded Yes | ||
Tolerance ±20% | ||
Maximum DC Resistance 53mΩ | ||
Series VLS-HBX-1 | ||
Core Material Metal | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature +105°C | ||
Inductor Construction Wire-Wound | ||
- COO (Country of Origin):
- CN
Magnetic shield type wound inductor for power circuits using a metallic magnetic material.
High magnetic shield construction and compatible with high-density mounting.
Larger current was achieved by the metallic magnetic material.
APPLICATION
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices, compact power supply modules, other
Application guides: Smart phones/tablets
High magnetic shield construction and compatible with high-density mounting.
Larger current was achieved by the metallic magnetic material.
APPLICATION
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices, compact power supply modules, other
Application guides: Smart phones/tablets