CTS, 767 4.7kΩ ±2% Isolated Resistor Array, 8 Resistors, 2.3W total, SOIC, Standard SMT
- RS Stock No.:
- 179-0319
- Mfr. Part No.:
- 767163472GP
- Brand:
- CTS
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 179-0319
- Mfr. Part No.:
- 767163472GP
- Brand:
- CTS
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | CTS | |
| Resistance | 4.7kΩ | |
| Resistor Type | Network | |
| Number of Resistors | 8 | |
| Package/Case | SOIC | |
| Power Rating | 2.3W | |
| Termination Style | Standard SMT | |
| Tolerance | ±2% | |
| Case Style | Moulded | |
| Power Rating per Resistor | 0.2W | |
| Circuit Designator | ISOL | |
| Length | 11.18mm | |
| Depth | 5.59mm | |
| Height | 2.36mm | |
| Dimensions | 11.18 x 5.59 x 2.36mm | |
| Series | 767 | |
| Number of Terminals | 16 | |
| Maximum Operating Temperature | +125°C | |
| Temperature Coefficient | ±200ppm/°C | |
| Minimum Operating Temperature | -55°C | |
| Select all | ||
|---|---|---|
Brand CTS | ||
Resistance 4.7kΩ | ||
Resistor Type Network | ||
Number of Resistors 8 | ||
Package/Case SOIC | ||
Power Rating 2.3W | ||
Termination Style Standard SMT | ||
Tolerance ±2% | ||
Case Style Moulded | ||
Power Rating per Resistor 0.2W | ||
Circuit Designator ISOL | ||
Length 11.18mm | ||
Depth 5.59mm | ||
Height 2.36mm | ||
Dimensions 11.18 x 5.59 x 2.36mm | ||
Series 767 | ||
Number of Terminals 16 | ||
Maximum Operating Temperature +125°C | ||
Temperature Coefficient ±200ppm/°C | ||
Minimum Operating Temperature -55°C | ||
- COO (Country of Origin):
- CN
767 Series Resistor Networks are single packaged devices containing an array of homogeneous resistor elements. CTS network designs provide a smaller circuit footprint, excellent reliability, improved TCR tracking and resistor tolerance matching, while helping to save placement costs by reducing application component count.
Surface Mount Gull Wing Package
Solid Ceramic Construction
Medium Body Design – 5.59mm
No Internal Dendrite Growth
Requires 30% Less Board Space Than Molded
Products of the Same Power Rating
Tape and Reel Packaging or Slide Pack
Applications:
Telecom Infrastructure
Optical Networking
Wireless Networks
Edge Routers
Internet/Network Security
Storage Area Networks
Network Attached Storage
Switches
RAID Controllers
Solid Ceramic Construction
Medium Body Design – 5.59mm
No Internal Dendrite Growth
Requires 30% Less Board Space Than Molded
Products of the Same Power Rating
Tape and Reel Packaging or Slide Pack
Applications:
Telecom Infrastructure
Optical Networking
Wireless Networks
Edge Routers
Internet/Network Security
Storage Area Networks
Network Attached Storage
Switches
RAID Controllers