AAT20, PCB Developing Kit FR4 35μm Copper Thick, 300 x 200 x 1.5mm

  • RS Stock No. 175-2780
  • Mfr. Part No. AAT20
  • Brand CIF
Technical Reference
Legislation and Compliance
RoHS Status: Not Applicable
COO (Country of Origin): FR
Product Details

Layered photosensitive boards, copper on aluminium

Pre-sensitised printed circuit boards for making power supply cards, SMT power transistor-based circuits, hybrid power circuits etc.
These boards are also used as Insulated Metal Substrate (IMS) in optoelectronics for the design of power LED circuits such as OSRAM's Golden Dragon and Luxeon Star.
Significant dissipation enables denser component layout.
Insulation fulfils three functions:
- adhesive between the copper and the aluminium
- dielectric insulation between the copper and the aluminium
- thermal relay between the active face of the circuit and the aluminium heat dissipating sole

Dimensions (mm): 200 x 300
Thickness: copper (35 μm), insulator (125 μm), aluminium (1.5 mm)
Dielectric strength: 51.5 kV / mm for insulation of about 100 μ
Dielectric constant about 3 at 1 MHz
Dielectric dissipation factor: about 0.02 at 1 MHz
Thermal dissipation: > at 1°C / W / mm2 (application type TO-220)
Operating temperature: 130°C continuous
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Specifications
Attribute Value
Base Material Aluminium
Dimensions 300 x 200 x 1.5mm
Copper Thickness 35µm
FR Material Grade FR4
Length 300mm
Thickness 1.5mm
Width 200mm
3 in stock for FREE next working day delivery
5 available from Europe for delivery within 1 working day(s)
Price Each
£ 35.75
(exc. VAT)
£ 42.90
(inc. VAT)
Units
Per unit
1 - 4
£35.75
5 - 9
£33.25
10 +
£31.60
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