Preci-Dip 1.27mm Pitch 68 Way DIP PLCC Socket

  • RS Stock No. 701-9402
  • Mfr. Part No. 540-88-068-24-008
  • Brand Preci-Dip
Technical Reference
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): CH
Product Details

Preci-dip 540 Series PLCC Sockets

These Swiss Preci-dip PLCC 540 Series sockets with SMT terminations to the PCB come with square sizes for IC packages according to JEDEC MO-047 and rectangular size (32 way) according to JEDEC MO-52, low profile.

Tape & Reel packs have Manufacturers Part Numbers ending in TR
Contact pressure minimum 1.5 N per contact
Mechanical life is a minimum of 50 cycles
Capacitance maximum 2 pF
Coplanarity SMD terminations maximum 0.1 mm

Standards

UL 94V-0

Specifications
Attribute Value
IC Socket Type PLCC Socket
Package Type DIP
Gender Female
Number of Contacts 68
Pitch 1.27mm
Body Orientation Straight
Contact Material Phosphor Bronze
Contact Plating Tin
Current Rating 1.0A
Voltage Rating 100.0 V, 150.0 V
Termination Method Solder
Housing Material Glass Fibre Reinforced PPS
320 In stock - FREE next working day delivery available
Price Each (In a Pack of 5)
£ 1.454
(exc. VAT)
£ 1.745
(inc. VAT)
Units
Per unit
Per Pack*
5 - 120
£1.454
£7.27
125 - 370
£1.308
£6.54
375 - 995
£1.162
£5.81
1000 - 1995
£1.018
£5.09
2000 +
£0.944
£4.72
*price indicative
Packaging Options:
Related Products
Textool™ test & burn-in SOIC sockets with a ...
Description:
Textool™ test & burn-in SOIC sockets with a compact envelope design and side to side stackability to maximise board density. The lid of these Textool™ test & burn-in SOIC sockets applies 80 gram normal force per lead for maximum electrical reliability, can be actuated from the front or top and ...
A range of PLCC surface mount sockets with ...
Description:
A range of PLCC surface mount sockets with phosphor bronze contacts. The contacts are set on a 0.1in. grid to match JEDEC patterns. Polarising feature ensures correct insertion of chip carriers. Suitable extraction tool (stock no. 480-3005). Low profile design, only 4.5mm high Window for solder joint inspection Standoffs for ...
81 Position BGA Plug, 0 mm Component Height, ...
Description:
81 Position BGA Plug, 0 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free. High density, high speed, discrete contact, array connector Flexible ground distribution optimizes high speed signal integrity10Gb/s differential pair performance with under 1% cross-talk28Gb/s high speed performance documented for 4 mm and 6 mm stack height ...
400 Position BGA Receptacle, 4 mm Component Height, ...
Description:
400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free. High density, high speed, discrete contact, array connector Flexible ground distribution optimizes high speed signal integrity10Gb/s differential pair performance with under 1% cross-talk28Gb/s high speed performance documented for 4 mm and 6 mm stack height ...