- RS Stock No.:
- 477-4840
- Mfr. Part No.:
- BP100-0.005-00-1112
- Brand:
- Bergquist
- RS Stock No.:
- 477-4840
- Mfr. Part No.:
- BP100-0.005-00-1112
- Brand:
- Bergquist
Technical Reference
Legislation and Compliance
- COO (Country of Origin):
- US
Product Details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
Note
Stock Number 477-4856 dimensions 150 x 150 x 0.127 mm
Stock Number 477-4862 dimensions 50 x 50 x 0.127 mm
Stock Number 4774878 dimensions 25 x 25 x 0.127 mm
Stock Number 477-4862 dimensions 50 x 50 x 0.127 mm
Stock Number 4774878 dimensions 25 x 25 x 0.127 mm
Specifications
Attribute | Value |
---|---|
Accessory Type | Adhesive Tape |
For Use With | Heatsink |
Related links
- Heatsink Mounting Accessories
- Bergquist Heatsink Mounting Accessories
- Elektronik Heatsink Mounting Accessories
- Fischer Elektronik Heatsink Mounting Clip for use with DIN Rail
- Malico Heatsink Clip for use with MBH27 BGA Heatsink
- Bergquist Heatsink Hi-Flow Insulator for use with Heatsink
- Bergquist Thermal Interface Sheet 1.6W/m·K 11 x 12in
- RS PRO Heatsink Tape for use with Heatsink