Cypress Semiconductor S25FS128SAGMFI100, CFI, SPI NOR 128Mbit Flash Memory Chip, 8-Pin SOIC

Technical Reference
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): US
Product Details

Density
S25FS128S-128 Mbits (16 MB)
S25FS256S-256 Mbits (32 MB)
Serial Peripheral Interface (SPI)
SPI Clock polarity and phase modes 0 and 3
Double Data Rate (DDR) option
Extended Addressing: 24- or 32-bit address options
Serial Command subset and footprint compatible with S25FL-A, S25FL-K, S25FL-P, and S25FL-S SPI families
Multi I/O Command subset and footprint compatible with S25FL-P, and S25FL-S SPI families
Read
Commands: Normal, Fast, Dual I/O, Quad I/O, DDR Quad
I/O
Modes: Burst Wrap, Continuous (XIP), QPI
Serial Flash Discoverable Parameters (SFDP) and Common Flash Interface (CFI), for configuration information
Program
256- or 512-byte Page Programming buffer
Program suspend and resume
Automatic ECC internal hardware Error Correction Code generation with single-bit error correction
Erase
Hybrid sector options
Physical set of eight 4-KB sectors and one 32-KB sector at the top or bottom of address space with all remaining sectors of 64 KB or
Physical set of eight 4-KB sectors and one 224-KB sector at the top or bottom of address space with all remaining sectors of 256 KB
Uniform sector options
Uniform 64-KB or 256-KB blocks for software
compatibility with higher density and future devices
Erase suspend and resume
Erase status evaluation
100,000 Program-Erase Cycles, minimum
20 Year Data Retention, minimum
Security Features
One-Time Program (OTP) array of 1024 bytes
Block Protection:
Status Register bits to control protection against
program or erase of a contiguous range of sectors
Hardware and software control options
Advanced Sector Protection (ASP)
Individual sector protection controlled by boot code or password
Option for password control of read access
Technology
Cypress 65 nm MirrorBit® Technology with Eclipse™
Architecture
Supply Voltage
1.7V to 2.0V
Packages (All Pb-Free)
8-lead SOIC 208 mil (SOC008) — FS128S only
WSON 6 x 5 mm (WND008) — FS128S only
WSON 6 x 8 mm (WNH008)
16-lead SOIC 300 mil (SO3016 — FS256S only)
BGA-24 6 x 8 mm
5 x 5 ball (FAB024) footprint
4 x 6 ball (FAC024) footprint
Known Good Die, and Known Tested Die

Specifications
Attribute Value
Memory Size 128Mbit
Interface Type CFI, SPI
Package Type SOIC
Pin Count 8
Organisation 16M x 8 bit
Mounting Type Surface Mount
Cell Type NOR
Minimum Operating Supply Voltage 1.7 V
Maximum Operating Supply Voltage 2 V
Length 5.28mm
Height 1.9mm
Width 5.28mm
Dimensions 5.28 x 5.28 x 1.9mm
Minimum Operating Temperature -40 °C
Number of Words 16M
Number of Bits per Word 8bit
Maximum Operating Temperature +85 °C
Available to back order for despatch 27/01/2021
Price Each (In a Tray of 280)
£ 1.862
(exc. VAT)
£ 2.234
(inc. VAT)
Units
Per unit
Per Tray*
280 +
£1.862
£521.36
*price indicative
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