MG Chemicals Carbon Conductive Adhesive Epoxy, 50 ml Tub

Technical Reference
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): CA
Product Details

MG Chemicals 8329 Slow Cure Conductive Adhesives

The MG Chemicals 8329TCS is a slow cure thermal conductive epoxy adhesive with excellent bonding strength and good thermal transfers is used for thermal management of high-powered electronics and LEDs. Once cured, the epoxy adhesive is inert under normal conditions so resists water and salt exposure.

Feature and Benefits

Easy to mix 1:1 mix ratio
Long shelf life
Adheres to most electronic substrates
Behaves like a 1-part adhesive for the length of a work shift
Once cured resists thermal and mechanical shocks in electronic assemblies

Typical Applications

Use as a die attach for electrical and electronics
Heat sink bonding
Use as a high-powered LED adhesive that maximises the lifetime of LEDs by dissipating their heat

Note

For substrate substances with weak adhesion strengths, surface preparation such as sanding or pre-coating with a suitable primer sometimes improves adhesion.

Specifications
Attribute Value
Product Type Epoxy
Conductive Element Carbon
Package Type Tub
Package Size 50 ml
Cure Time 20 min
Dielectric Strength 7.5kV/mm
Maximum Operating Temperature +200°C
Operating Temperature Range -70 → +200 °C
Odour Slight
Specific Gravity 2.41
Minimum Operating Temperature -70°C
Thermal Conductivity 1.44W/mK
Physical Form Liquid
5 In stock for FREE next working day delivery
Price Each
£ 38.41
(exc. VAT)
£ 46.09
(inc. VAT)
Units
Per unit
1 +
£38.41
Related Products
TPM550 features high thermal conductivity of 5.5 W/m.K ...
Description:
TPM550 features high thermal conductivity of 5.5 W/m.K and becomes workable at approximately 45°C. The material’s advanced formulation ensures minimal contact thermal resistance. Like TPM350, TPM550 also produces no mess due to its thixotropic characteristics which prevent flow outside of defined interfaces. TPM550 can be reworked and its lower specific ...
ER2224 Epoxy potting compound is a highly thermally ...
Description:
ER2224 Epoxy potting compound is a highly thermally conductive resin (0.8 W/m*K) which also offers strong thermal cycling properties. It is an off-white resin allowing it to blend with LED designs, dissipating heat from the LED and extending the units operating lifetime and reliability while offering excellent environmental protection against ...
The Electrolube 250g epoxy resin is a flame ...
Description:
The Electrolube 250g epoxy resin is a flame retardant, thermally conductive, 2-part potting and encapsulating compound. This technology used is of the ’clean’ type, leading to relatively low toxicity fumes and low smoke emission. Casting compound for encapsulating electronic assemblies Vibration isolation and prevention of stress exposure ER 2074 RS ...
The 832FX Black Flexible Epoxy Encapsulating and Potting ...
Description:
The 832FX Black Flexible Epoxy Encapsulating and Potting Compound is an economical, electronic-grade, two-part system that is flowable. Its cured form is flexible offering excellent physical, chemical, and electrical protection, and providing some small amount of thermal conductivity. It protects against static discharges, thermal shocks, vibrations, and mechanical impacts. It ...