Adaptive Peltier Module, 82.2W, 8.4A, 15.7V, 40 x 40mm
- RS Stock No.:
- 490-1525
- Mfr. Part No.:
- ETH-127-14-11-S-RS
- Brand:
- Adaptive
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Units | Per unit |
|---|---|
| 1 - 4 | £50.54 |
| 5 - 9 | £48.02 |
| 10 - 24 | £46.50 |
| 25 - 99 | £44.48 |
| 100 + | £39.43 |
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- RS Stock No.:
- 490-1525
- Mfr. Part No.:
- ETH-127-14-11-S-RS
- Brand:
- Adaptive
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Adaptive | |
| Maximum Cooling Capacity | 82.2W | |
| Maximum Temperature Difference | +71K | |
| Maximum Current | 8.4A | |
| Maximum Voltage | 15.7V | |
| Active Area | 40 x 40mm | |
| Active Area Length | 40mm | |
| Active Area Thickness | 3.8mm | |
| Active Area Width | 40mm | |
Select all | ||
|---|---|---|
Brand Adaptive | ||
Maximum Cooling Capacity 82.2W | ||
Maximum Temperature Difference +71K | ||
Maximum Current 8.4A | ||
Maximum Voltage 15.7V | ||
Active Area 40 x 40mm | ||
Active Area Length 40mm | ||
Active Area Thickness 3.8mm | ||
Active Area Width 40mm | ||
- COO (Country of Origin):
- CN
Thermoelectric Cooler Modules, Adaptive
The Thermoelectric modules utilise the Peltier phenomenon principle to pump heat when voltage is applied.
Effective cooling power from mW to a hundred of Watts
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options
Thermoelectric Modules - Peltier Effect
A range of semiconductor thermoelectric devices working on the Peltier effect. When supplied with a suitable electric current, they can either cool or heat. When subject to an externally applied temperature gradient these devices will generate a small amount of electrical power.The larger devices can be used for cooling or controlling the temperature of sub-assemblies. The small size of the mini module makes it ideally suited for cooling miniature electronic components such as infra-red detector chips, microwave IC's, fibre-optic lasers and detectors.,Alternatively, it may be used to minimise the effects of temperature coefficients on oscillator stability, reference voltages, amplifier offsets etc. by providing temperature control.
Solid-state long term stability
Generates no acoustic noise
Generates no acoustic noise
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