Hi-Flow phase change 1W/mK 280x300mm
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Specifications
| Dimensions | 11 x 12in | |
| Length | 11in | |
| Material | Hi-Flow 225F-AC | |
| Material Trade Name | Hi-Flow 225F-AC | |
| Maximum Operating Temperature | +120°C | |
| Self-Adhesive | Yes | |
| Thermal Conductivity | 1W/m·K | |
| Thickness | 0.102mm | |
| Width | 12in |
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Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules
Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm